Specifically, ASML plans to enter the field of advanced packaging — a technology that connects and stacks multiple specialized chips together. This architecture is critical for modern AI processors and the high-speed memory systems that power them. TSMC already relies on advanced packaging to manufacture Nvidia’s most powerful AI chips.

According to Pieters, ASML plans its strategy 10 to 15 years ahead and is currently evaluating what types of machinery the industry will require in the future for packaging and bonding processes. The company is also exploring whether chips can be printed beyond current size limits — roughly the size of a postage stamp.

In addition, ASML intends to deploy AI to accelerate the control software of its machines and to improve quality inspection during chip production, signaling a broader push to integrate artificial intelligence into its manufacturing ecosystem